The 𝐄𝐏𝐂𝟐𝟑𝟎𝟓 is a 150 V enhancementmode GaN FET housed in a compact 3 mm × 5 mm low-inductance QFN package with an exposed top surface for improved thermal management. It’s typical RDS (on) of 2.2 mΩ (maximum 3 mΩ) enables exceptionally low conduction losses, making it suitable for high-current applications. The device supports a continuous drain current of 133 A below 125 °C and a pulsed current rating of 329 A (at 25 °C), demonstrating its capability to handle demanding transient loads. One of the standout features of the 𝐄𝐏𝐂𝟐𝟑𝟎𝟓 is its Thermal-Max package, which includes an exposed top metal surface. This design significantly reduces the thermal resistance from junction to case, achieving a value of 0.2 °C/W, enabling efficient heat extraction through topside cooling.
The 𝐄𝐏𝐂𝟐𝟑𝟎𝟓 is optimized for a wide range of modern power‑electronics applications, including:
# High‑frequency DC‑DC Converters
# AC‑DC Charger and Adapters
# BLDC Motor Drives
# eMobility Motor Controllers
# Solar Optimizers and MPPT Systems
# Class‑D Audio amplifiers
# Fast chargers for phones, notebooks, and gaming PCs
# Power tools, home robotics, and vacuum cleaners
In these applications, the 𝐄𝐏𝐂𝟐𝟑𝟎𝟓’s combination of high efficiency, low losses, and compact size enables designers to achieve higher power density and improved thermal behaviour. The 𝐄𝐏𝐂𝟐𝟑𝟎𝟓 represents a significant advancement in GaN power transistor technology. Its combination of 150 V capability, 2.2 mΩ on resistance, ultralow switching losses, and innovative Thermal Max packaging make it an excellent choice for next generation power-electronics systems. Finepower FAE Team will technically support your design activities, your Innovation Hub is ready. Finepower GmbH EPC – Efficient Power Conversion
